D. F. Lim

Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

Chuan Seng Tan, D. F. Lim, Shiv Govind Singh et al. · Applied Physics Letters · 2009 · 179 citations

Engineering, Sam Layer, Surface Nanotechnology +19

Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Chuan Seng Tan, D. F. Lim, X. F. Ang et al. · Microelectronics Reliability · 2011 · 75 citations

Materials Science, Bond Strength Enhancement, Engineering +9

Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

Ji Fan, D. F. Lim, Chuan Seng Tan · Journal of Micromechanics and Microengineering · 2013 · 47 citations · Full text

Engineering, Bonding Quality, Mechanical Engineering +22

High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation

Lan Peng, Hongyu Li, D. F. Lim et al. · IEEE Transactions on Electron Devices · 2011 · 39 citations

Cu–cu Contacts, Engineering, Cu Damascene Structures +16

Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

Chuan Seng Tan, Ji Fan, D. F. Lim et al. · Journal of Micromechanics and Microengineering · 2011 · 36 citations

Engineering, Metallic Copper–copper, Integrated Circuits +19