Concepedia

D. F. Lim

DF

Statistics

Publications

22

Citations

733

H-Index

17

Active since

2009

Affiliations

Nanyang Technological University(Current)

Singapore Institute of Manufacturing Technology

GlobalFoundries (Singapore)

Agency for Science, Technology and Research

Institute of Microelectronics

D. F. Lim is an author at Nanyang Technological University specializing in materials science, materials engineering, and engineering.

Publications per year

2009–2013

22

Publications

22

Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

Chuan Seng Tan, D. F. Lim, Shiv Govind Singh et al. · Applied Physics Letters · 2009 · 181 citations

, , +17

Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Chuan Seng Tan, D. F. Lim, X. F. Ang et al. · Microelectronics Reliability · 2011 · 76 citations

, , +17

Effects of surface treatment on the bonding quality of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration

Ji Fan, D. F. Lim, Chuan Seng Tan · Journal of Micromechanics and Microengineering · 2013 · 49 citations · Full text

, , +15

High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation

Lan Peng, Hongyu Li, D. F. Lim et al. · IEEE Transactions on Electron Devices · 2011 · 40 citations

, , +17

Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

Chuan Seng Tan, Ji Fan, D. F. Lim et al. · Journal of Micromechanics and Microengineering · 2011 · 36 citations

, , +17

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