Concepedia

X. F. Ang

XF

10

Publications

387

Citations

10

H-Index

2005

Active since

Affiliations

Singapore Institute of Manufacturing Technology(Current)

Nanyang Technological University

GlobalFoundries (Singapore)

Singapore University of Social Sciences

X. F. Ang is an author at Singapore Institute of Manufacturing Technology specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsSurface ScienceSelf-assemblyChemistryThermal EngineeringMaterials EngineeringMolecular Self-assemblyNanotechnology

Publications per year

2005–2012

10

Publications

10

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 158 citations

Materials Science, Wafer Scale Processing, Engineering +11

Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Chuan Seng Tan, D. F. Lim, X. F. Ang et al. · Microelectronics Reliability · 2011 · 75 citations

Materials Science, Bond Strength Enhancement, Engineering +9

Temperature and pressure dependence in thermocompression gold stud bonding

X. F. Ang, G.G. Zhang, Jun Wei et al. · Thin Solid Films · 2005 · 28 citations

Materials Science, Materials Engineering, Pressure Dependence +6

Self-assembled monolayers for reduced temperature direct metal thermocompression bonding

X. F. Ang, F. Y. Li, Wen Ling Lenice Tan et al. · Applied Physics Letters · 2007 · 23 citations · Full text

Engineering, Self-assembled Monolayers, Molecular Self-assembly +19

Low Temperature Copper-Copper Thermocompression Bonding

X. F. Ang, A. T. Lin, Jun Wei et al. · 2008 · 21 citations

Engineering, Mechanical Engineering, Corrosion +16

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