Andy Fan - Concepedia

Concepedia

Author

Andy Fan

Massachusetts Institute of Technology ORCID

Also Known As

A. Fan, Andy Fan, Fan, Andy

59

Publications

2.2K

Citations

25

H-Index

60

Concepts

All Affiliations

Massachusetts Institute of Technology Boston University Harvard University Institut Polytechnique de Bordeaux Laboratoire de Chimie des Polymères Organiques

AF

About

Andy Fan is an author at Massachusetts Institute of Technology specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	21	1.4K
2	Applied Physics	11	12	901
3	Medicine	3	3	80
4	Biomedical Engineering	2	2	43
5	Chemical Engineering	2	2	45

Andy Fan

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32

Publications

2.2K

Citations

25

H-Index

	Year	Citations
Copper Wafer Bonding Andy Fan Electrochemical and Solid-State Letters Materials ScienceTantalum Diffusion BarrierWafer Scale ProcessingEngineeringBonding Strength	1999	211
Paper-Based RNA Extraction, <i>in Situ</i> Isothermal Amplification, and Lateral Flow Detection for Low-Cost, Rapid Diagnosis of Influenza A (H1N1) from Clinical Specimens Natalia M. Rodriguez, Jacqueline C. Linnes, Andy Fan, Analytical Chemistry	2015	184
Morphology and Bond Strength of Copper Wafer Bonding Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan, Electrochemical and Solid-State Letters Materials EngineeringMaterials ScienceElectromigration TechniqueWafer Scale ProcessingEngineering	2003	163
Technology, performance, and computer-aided design of three-dimensional integrated circuits Shamik Das, Andy Fan, Kuan‐Neng Chen, EngineeringDevice IntegrationElectronic DesignComputer ArchitectureComputer-aided Design	2004	141
Fabrication technologies for three-dimensional integrated circuits R. Reif, Andy Fan, Kuan‐Neng Chen, Device WafersEngineeringComputer-aided DesignIntegrated CircuitsInterconnect (Integrated Circuits)	2003	127
Low concentration DNA extraction and recovery using a silica solid phase Constantinos Katevatis, Andy Fan, Catherine M. Klapperich PLoS ONE	2017	112
Microstructure evolution and abnormal grain growth during copper wafer bonding Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, Applied Physics Letters Materials ScienceGrain OrientationsWafer Scale ProcessingEngineeringSevere Plastic Deformation	2002	103
A progesterone biosensor derived from microbial screening Chloé Grazon, R C. Baer, Uroš Kuzmanović, Nature Communications	2020	86
Paper-based molecular diagnostic for Chlamydia trachomatis Jacqueline C. Linnes, Andy Fan, Natalia M. Rodriguez, RSC Advances	2014	82
Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, IEEE Electron Device Letters EngineeringMechanical EngineeringTest StructureInterconnect (Integrated Circuits)Bonded Copper Interconnects	2004	76

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