Concepedia

Andy Fan

AF

32

Publications

2.2K

Citations

25

H-Index

1999

Active since

Affiliations

Massachusetts Institute of Technology(Current)

Boston University

Harvard University

Institut Polytechnique de Bordeaux

Laboratoire de Chimie des Polymères Organiques

Andy Fan is an author at Massachusetts Institute of Technology specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingMaterial ScienceApplied Physics3D IntegrationMaterials EngineeringElectrical EngineeringSurface ScienceMicrofabrication

Publications per year

1999–2022

32

Publications

32

Copper Wafer Bonding

Andy Fan · Electrochemical and Solid-State Letters · 1999 · 211 citations

Materials Science, Tantalum Diffusion Barrier, Wafer Scale Processing +12

Paper-Based RNA Extraction, <i>in Situ</i> Isothermal Amplification, and Lateral Flow Detection for Low-Cost, Rapid Diagnosis of Influenza A (H1N1) from Clinical Specimens

Natalia M. Rodriguez, Jacqueline C. Linnes, Andy Fan et al. · Analytical Chemistry · 2015 · 184 citations · Full text

Morphology and Bond Strength of Copper Wafer Bonding

Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan et al. · Electrochemical and Solid-State Letters · 2003 · 163 citations

Materials Engineering, Materials Science, Electromigration Technique +14

Technology, performance, and computer-aided design of three-dimensional integrated circuits

Shamik Das, Andy Fan, Kuan‐Neng Chen et al. · 2004 · 141 citations

Engineering, Device Integration, Electronic Design +19

Fabrication technologies for three-dimensional integrated circuits

R. Reif, Andy Fan, Kuan‐Neng Chen et al. · 2003 · 127 citations

Device Wafers, Engineering, Computer-aided Design +18

Rows per page

1–5 of 32