R. Reif

Interconnect limits on gigascale integration (GSI) in the 21st century

Jeffrey A. Davis, A. E. Kaloyeros, M. Beylansky et al. · Proceedings of the IEEE · 2001 · 514 citations

Engineering, Computer Engineering, Electrical Engineering +17

Recrystallization of amorphized polycrystalline silicon films on SiO2: Temperature dependence of the crystallization parameters

R.B. Iverson, R. Reif · Journal of Applied Physics · 1987 · 359 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

System-level performance evaluation of three-dimensional integrated circuits

Arif Rahman, R. Reif · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2000 · 199 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Morphology and Bond Strength of Copper Wafer Bonding

Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan et al. · Electrochemical and Solid-State Letters · 2003 · 163 citations

Engineering, Materials Engineering, Materials Science +14

Silicon epitaxy at 650–800 °C using low-pressure chemical vapor deposition both with and without plasma enhancement

T. J. Donahue, R. Reif · Journal of Applied Physics · 1985 · 144 citations

Engineering, Materials Engineering, Materials Science +17