S.J. Souri

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Computer Engineering, Electrical Engineering +17

Interconnect limits on gigascale integration (GSI) in the 21st century

Jeffrey A. Davis, A. E. Kaloyeros, M. Beylansky et al. · Proceedings of the IEEE · 2001 · 514 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal analysis of heterogeneous 3D ICs with various integration scenarios

Ting-Yen Chiang, S.J. Souri, Chi On Chui et al. · 2002 · 118 citations

Engineering, Computer Engineering, Computer Systems +17

Multiple Si layer ICs

S.J. Souri, Kaustav Banerjee, Amit Mehrotra et al. · 2000 · 107 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Low-leakage germanium-seeded laterally-crystallized single-grain 100-nm TFTs for vertical integration applications

Vivek Subramanian, Masato Toita, Nour Ibrahim et al. · IEEE Electron Device Letters · 1999 · 65 citations

Engineering, Electrical Engineering, Materials Science +17