Concepedia

Warren C. Welch

WC

5

Publications

174

Citations

5

H-Index

1997

Active since

Affiliations

University of Michigan(Current)

Warren C. Welch is an author at University of Michigan specializing in electrical engineering, microelectronics, and microfabrication.

Top concepts

EngineeringMicroelectronicsMicrofabricationElectrical EngineeringApplied PhysicsMaterial ScienceElectronic PackagingMechanical EngineeringInstrumentationMaterials Engineering

Publications per year

1997–2010

5

Publications

5

Transfer of metal MEMS packages using a wafer-level solder transfer technique

Warren C. Welch, Junseok Chae, K. Najafi · IEEE Transactions on Advanced Packaging · 2005 · 60 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

Warren C. Welch, Khalil Najafi · Proceedings, IEEE micro electro mechanical systems · 2008 · 57 citations

Materials Science, Vacuum Environment, Electrical Engineering +15

Wafer-level vacuum/hermetic packaging technologies for MEMS

Sang Hyun Lee, J. Mitchell, Warren C. Welch et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2010 · 24 citations

Nickel-Tin Transient Liquid Phase (TLP) Wafer Bonding for MEMS Vacuum Packaging

Warren C. Welch, K. Najafi · TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference · 2007 · 22 citations

Engineering, Mechanical Engineering, Vacuum Device +16

Plasma etching and patterning of CVD diamond at <100°C for microelectronics applications

R. Ramesham, Warren C. Welch, W. C. Neely et al. · Thin Solid Films · 1997 · 11 citations

Materials Science, Electrical Engineering, Plasma Electronics +9

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