Concepedia

Jürgen Burggraf

JB

Statistics

Publications

9

Citations

187

H-Index

9

Active since

2009

Affiliations

EV Group (Austria)(Current)

Jürgen Burggraf is an author at EV Group (Austria) specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceMicrofabricationElectrical EngineeringComputer EngineeringSurface ScienceAdvanced Packaging

Publications per year

2009–2023

9

Publications

9

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Drăgoi, Eric Pabo, Jürgen Burggraf et al. · Microsystem Technologies · 2012 · 33 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +10

Heterogeneous Integration by Collective Die-To-Wafer Bonding

Thomas Uhrmann, Jürgen Burggraf, Martin Eibelhuber · 2018 · 25 citations

Engineering, Computer Architecture, Collective Die Bonding +20

0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory

Kai Ma, Nikolaos Bekiaris, Sesh Ramaswami et al. · 2023 · 25 citations

Engineering, Integrated Circuits, Test Vehicle +19

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Drăgoi, Gerald Mittendorfer, Jürgen Burggraf et al. · ECS Transactions · 2010 · 24 citations

Aluminium Nitride, Engineering, Wafer Scale Processing +17

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Serena Iacovo, Lan Peng, Fuya Nagano et al. · 2021 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +15

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