Sesh Ramaswami

Adhesion studies of CVD copper metallization

Srinivas Gandikota, Steve Voss, Rong Tao et al. · Microelectronic Engineering · 2000 · 41 citations

Materials Engineering, Materials Science, Engineering +7

Robust TSV via-middle and via-reveal process integration accomplished through characterization and management of sources of variation

Niranjan Kumar, Sesh Ramaswami, John Dukovic et al. · 2012 · 28 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +14

0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory

Kai Ma, Nikolaos Bekiaris, Sesh Ramaswami et al. · 2023 · 25 citations

Engineering, Integrated Circuits, Test Vehicle +19

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Aditya P. Karmarkar, Xiaopeng Xu, Sesh Ramaswami et al. · MRS Proceedings · 2010 · 23 citations

Materials Engineering, Engineering, Advanced Packaging (Semiconductors) +10

Chemical studies of CVD Cu deposited on Ta and TaN barriers under various process conditions

Steve Voss, Srinivas Gandikota, Liang-Yuh Chen et al. · Microelectronic Engineering · 2000 · 18 citations

Materials Science, Chemical Engineering, Chemical Studies +9