Xiaopeng Xu

Performanace and reliability analysis of 3D-integration structures employing Through Silicon Via (TSV)

Aditya P. Karmarkar, Xiaopeng Xu, Victor Moroz · 2009 · 128 citations

Engineering, 3D-integration Structures, Mechanical Engineering +23

pMOSFET with 200% mobility enhancement induced by multiple stressors

L. Washington, F. Nouri, S. Thirupapuliyur et al. · IEEE Electron Device Letters · 2006 · 68 citations

Materials Engineering, Electrical Engineering, Engineering +15

Modeling the impact of stress on silicon processes and devices

Victor Moroz, N. Strecker, Xiaopeng Xu et al. · Materials Science in Semiconductor Processing · 2003 · 46 citations

Electrical Engineering, Engineering, Hardware Reliability +11

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Aditya P. Karmarkar, Xiaopeng Xu, Sesh Ramaswami et al. · MRS Proceedings · 2010 · 23 citations

Materials Engineering, Engineering, Advanced Packaging (Semiconductors) +10

Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias

Aditya P. Karmarkar, Xiaopeng Xu, Kong‐Boon Yeap et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 19 citations

Elastic Anisotropy, Engineering, Mechanical Engineering +18