Thomas Uhrmann

Magnetostrictive GMR sensor on flexible polyimide substrates

Thomas Uhrmann, L. Bär, Théodoros Dimopoulos et al. · Journal of Magnetism and Magnetic Materials · 2006 · 60 citations

Engineering, Materials Engineering, Magnetic Materials +13

Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology

Lan Peng, Serena Iacovo, Fumihiro Inoue et al. · 2018 · 46 citations

Engineering, Materials Engineering, Materials Science +17

Characterization of embedded MgO/ferromagnet contacts for spin injection in silicon

Thomas Uhrmann, Théodoros Dimopoulos, H. Brückl et al. · Journal of Applied Physics · 2008 · 31 citations

Natural Sciences, Electrical Engineering, Materials Science +17

0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory

Kai Ma, Nikolaos Bekiaris, Sesh Ramaswami et al. · 2023 · 28 citations

Engineering, Materials Science, Electronic Materials +13

Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Serena Iacovo, Lan Peng, Fuya Nagano et al. · 2021 · 27 citations

Engineering, Materials Engineering, Materials Science +17