Concepedia
Statistics
Publications
17
Citations
386
H-Index
13
Active since
2006
Affiliations
EV Group (Austria)(Current)
IMEC
Austrian Institute of Technology
University of Oxford
Applied Materials (United States)
Thomas Uhrmann is an author at EV Group (Austria) specializing in engineering, applied physics, and microelectronics.
Top concepts
EngineeringApplied PhysicsMicroelectronicsMaterial ScienceElectronic PackagingElectrical EngineeringMicrofabricationComputer EngineeringMaterials EngineeringThree-dimensional Heterogeneous Integration
Publications per year
2006–2024
Magnetostrictive GMR sensor on flexible polyimide substrates
Thomas Uhrmann, L. Bär, Théodoros Dimopoulos et al. · Journal of Magnetism and Magnetic Materials · 2006 · 59 citations
Engineering, Flexible Sensors, Flexible Electronics +6
Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
Lan Peng, Sang‐Woo Kim, Serena Iacovo et al. · 2018 · 43 citations
Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20
Characterization of embedded MgO/ferromagnet contacts for spin injection in silicon
Thomas Uhrmann, Théodoros Dimopoulos, H. Brückl et al. · Journal of Applied Physics · 2008 · 31 citations
Engineering, Magnetic Resonance, Spintronic Material +18
TEM Study on Diffusion Process of NiFe Schottky and MgO/NiFe Tunneling Diodes for Spin Injection in Silicon
Je-Hyun Lee, Thomas Uhrmann, Théodoros Dimopoulos et al. · IEEE Transactions on Magnetics · 2010 · 25 citations
Mgo/nife Tunneling Diodes, Engineering, Tunneling Diodes +16
Heterogeneous Integration by Collective Die-To-Wafer Bonding
Thomas Uhrmann, Jürgen Burggraf, Martin Eibelhuber · 2018 · 25 citations
Engineering, Computer Architecture, Collective Die Bonding +20
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