Thomas Plach

Mechanisms for room temperature direct wafer bonding

Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno et al. · Journal of Applied Physics · 2013 · 188 citations

Engineering, Materials Engineering, Materials Science +17

Interdiffusion in Heusler film epitaxy on GaAs(001)

C Gusenbauer, Tanveer Ashraf, J. Stangl et al. · Physical Review B · 2011 · 27 citations

Natural Sciences, Materials Science, Physics +17

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur et al. · 2023 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Dielectric Function of Undoped and Doped Poly[2-methoxy-5-(3′,7′-dimethyloctyloxy)-1,4-phenylene-vinylene] by Ellipsometry in a Wide Spectral Range

Jacek Gąsiorowski, Kurt Hingerl, Reghu Menon et al. · The Journal of Physical Chemistry C · 2013 · 22 citations · Full text

Natural Sciences, Materials Science, Physics +17

Cu-Cu wafer bonding: An enabling technology for three-dimensional integration

Bernhard Rebhan, Thomas Plach, Sajjad Tollabimazraehno et al. · 2014 · 15 citations

Engineering, Materials Engineering, Materials Science +13