Statistics
Publications
11
Citations
440
H-Index
10
Active since
2016
Affiliations
Oguzhan Orkut Okudur is an author at IMEC specializing in materials science, materials engineering, and mechanical behavior of materials.
Publications per year
2016–2024
11
11
Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 135 citations
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur et al. · 2023 · 23 citations
Oguzhan Orkut Okudur, Kris Vanstreels, Ingrid De Wolf et al. · Journal of Applied Physics · 2016 · 16 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17
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