Concepedia

Bernhard Rebhan

BR

Statistics

Publications

13

Citations

368

H-Index

11

Active since

2013

Affiliations

EV Group (Austria)(Current)

Johannes Kepler University of Linz

STMicroelectronics (France)

Materials Center Leoben (Austria)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Bernhard Rebhan is an author at EV Group (Austria) specializing in wafer bonding, engineering, and materials engineering.

Publications per year

2013–2019

13

Publications

13

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Physical mechanisms of copper-copper wafer bonding

Bernhard Rebhan, Kurt Hingerl · Journal of Applied Physics · 2015 · 80 citations

Engineering, Materials Engineering, Materials Science +17

Low-Temperature Cu-Cu Wafer Bonding

Bernhard Rebhan, Günter Hesser, Jiri Duchoslav et al. · ECS Transactions · 2013 · 35 citations

Engineering, Materials Engineering, Materials Science +15

Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach

Thomas Wlanis, René Hammer, Werner Ecker et al. · Microelectronics Reliability · 2018 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation

Bernhard Rebhan, Sajjad Tollabimazraehno, Günter Hesser et al. · Microsystem Technologies · 2015 · 19 citations

Engineering, Materials Engineering, Materials Science +14

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