Kalispell Regional Medical Center

Through silicon via copper electrodeposition for 3D integration

Rozalia Beica, Charles Sharbono, Tom Ritzdorf · 2008 · 126 citations

Engineering, Packaging Technologies, Interconnect (Integrated Circuits) +16

COG8 deficiency causes new congenital disorder of glycosylation type IIh

Christian Kranz, Bobby G. Ng, Liangwu Sun et al. · Human Molecular Genetics · 2007 · 121 citations · Full text

Developmental Biology, Somatic Variant, Mendelian Disorder +14

An Assessment of Early Steps: A Program for Early Intervention of Reading Problems

Carol M. Santa, Torleiv Høien · Reading Research Quarterly · 1999 · 112 citations

Language Development, Atypical Language Development, Story Reading +30

Increased eDNA detection sensitivity using a novel high‐volume water sampling method

Jenna Schabacker, Stephen J. Amish, Bonnie K. Ellis et al. · Environmental DNA · 2020 · 93 citations · Full text

Environmental Monitoring, Edna Samples, Engineering +20

Factors Affecting Copper Filling Process Within High Aspect Ratio Deep Vias for 3D Chip Stacking

Bioh Kim, Charles Sharbono, Tom Ritzdorf et al. · 2006 · 87 citations

Engineering, Interconnect (Integrated Circuits), Copper Filling +16