Concepedia

V. Balan

VB

Statistics

Publications

20

Citations

716

H-Index

14

Active since

2003

Affiliations

CEA Grenoble(Current)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Laboratoire d'Électronique des Technologies de l'Information

Université Grenoble Alpes

STMicroelectronics (France)

V. Balan is an author at CEA Grenoble specializing in engineering, electrical engineering, and materials science.

Publications per year

2003–2020

20

Publications

20

Vertically stacked-NanoWires MOSFETs in a replacement metal gate process with inner spacer and SiGe source/drain

Sylvain Barraud, V. Lapras, Marie-Pierre Samson et al. · 2016 · 110 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

3D Sequential Integration: Application-driven technological achievements and guidelines

P. Batude, Laurent Brunet, C. Fenouillet-Béranger et al. · 2017 · 75 citations

Engineering, Computer Engineering, Electrical Engineering +15

Breakthroughs in 3D Sequential technology

Laurent Brunet, C. Fenouillet-Béranger, P. Batude et al. · 2018 · 52 citations

Engineering, Electrical Engineering, Materials Science +13

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