3D Sequential Integration: Application-driven technological achievements and guidelines

Abstract

3D Sequential Integration (3DSI) with ultra-small 3D contact pitch (<;100nm) offers new 3D partitioning options at fine granularities. This paper reviews potential applications ranging from computing to sensor interface and gives an update on 3DSI device development. Low-temperature processing techniques have made great progress and High Performance (HP) digital stacked FETs for computing application can be achieved with a 500°C Thermal Budget (TB). In addition, ULK/metal lines capable of withstanding this TB can be used between stacked tiers. Ultra-Low TB FETs (<;400°C) have potential for low-power applications and allow for the stacking of multiple layers.