Sébastien Thuries

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 136 citations

Engineering, Computer Engineering, Electrical Engineering +15

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

3D Sequential Integration: Application-driven technological achievements and guidelines

P. Batude, Laurent Brunet, C. Fenouillet-Béranger et al. · 2017 · 75 citations

Engineering, Computer Engineering, Electrical Engineering +15

3D sequential integration opportunities and technology optimization

P. Batude, B. Sklénard, C. Fenouillet-Béranger et al. · 2014 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +16

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · 2020 · 60 citations

Engineering, Computer Engineering, High-performance Computing +17