N. Bresson

Statistics

Publications

Citations

472

H-Index

Active since

2004

Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives(Current)

Université Grenoble Alpes

Laboratoire d'Électronique des Technologies de l'Information

CEA Grenoble

Soitec (France)

N. Bresson is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, materials science, and interconnect technology.

Publications per year

2004–2024

Publications

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Integration of buried insulators with high thermal conductivity in SOI MOSFETs: Thermal properties and short channel effects

N. Bresson, S. Cristoloveanu, C. Mazuré et al. · Solid-State Electronics · 2005 · 59 citations

Engineering, Electrical Engineering, Materials Science +17

Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

L. Arnaud, C. Karam, N. Bresson et al. · MRS Communications · 2020 · 40 citations

Engineering, Materials Engineering, Materials Science +14

Through Silicon Via technology using tungsten metallization

G. Parès, N. Bresson, S. Minoret et al. · 2011 · 36 citations

Engineering, Electrical Engineering, Materials Science +17

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Engineering, Materials Science, Electronic Materials +13

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