N. Bresson

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 81 citations

Engineering, Device Integration, Integrated Circuits +24

Integration of buried insulators with high thermal conductivity in SOI MOSFETs: Thermal properties and short channel effects

N. Bresson, S. Cristoloveanu, C. Mazuré et al. · Solid-State Electronics · 2005 · 59 citations

Electrical Engineering, High Thermal Conductivity, Engineering +12

Through Silicon Via technology using tungsten metallization

G. Parès, N. Bresson, S. Minoret et al. · 2011 · 36 citations

Tungsten Tsv Technology, Engineering, Mechanical Engineering +19

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

L. Arnaud, C. Karam, N. Bresson et al. · MRS Communications · 2020 · 34 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +12