Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi et al. · 2016 · 234 citations

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Proceedings of 1994 IEEE International Electron Devices Meeting

1994 · 183 citations

Engineering, Electrical Engineering, Physics +12

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 65 citations

Engineering, Computer Engineering, Computer Systems +17