Gaëlle Mauguen

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

L. Arnaud, C. Karam, N. Bresson et al. · MRS Communications · 2020 · 34 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +12

Adhesion Energy and Bonding Wave Velocity Measurements

Vincent Larrey, Gaëlle Mauguen, Frank Fournel et al. · ECS Transactions · 2016 · 19 citations

Materials Science, Engineering, Stabilized Adhesion Energy +13

A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors

A. Jouve, E. Lagoutte, Romain Crochemore et al. · 2020 · 15 citations

Medical Electronics, Engineering, Device Integration +19

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Emilie Bourjot, Paul Stewart, Christophe Dubarry et al. · 2019 · 10 citations