Emilie Bourjot

22nm FDSOI technology for emerging mobile, Internet-of-Things, and RF applications

R. Carter, J. Mazurier, Luca Pirro et al. · 2016 · 283 citations · Full text

Engineering, Vlsi Design, Radio Frequency +16

Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration

Alice Bond, Emilie Bourjot, S. Borel et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 19 citations

Engineering, Molecular Self-assembly, Die Assembly Throughput +26

Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

Emilie Bourjot, C. Castan, Noura Nadi et al. · 2021 · 17 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +16

Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

Emilie Bourjot, Alice Bond, Noura Nadi et al. · 2023 · 16 citations

A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors

A. Jouve, E. Lagoutte, Romain Crochemore et al. · 2020 · 15 citations

Medical Electronics, Engineering, Device Integration +19