Concepedia

Alice Bond

AB

Statistics

Publications

3

Citations

52

H-Index

3

Active since

2021

Affiliations

Université Grenoble Alpes(Current)

Laboratoire d'Électronique des Technologies de l'Information

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Intel (United States)

Alice Bond is an author at Université Grenoble Alpes specializing in 3d printing, microelectronics, and materials science.

Top concepts

3D PrintingEngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingThree-dimensional Heterogeneous IntegrationSelf-assembly3D IntegrationApplied Physics

Publications per year

2021–2023

3

Publications

3

Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration

Alice Bond, Emilie Bourjot, S. Borel et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 19 citations

Engineering, Molecular Self-assembly, Die Assembly Throughput +26

Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

Emilie Bourjot, C. Castan, Noura Nadi et al. · 2021 · 17 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +16

Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding

Emilie Bourjot, Alice Bond, Noura Nadi et al. · 2023 · 16 citations

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