Adhesion Energy and Bonding Wave Velocity Measurements

Abstract

Adhesion energy and bonding wave velocity are key parameters that should be controlled in an industrial direct bonding process because it reports what exactly occurs at the time of the bonding. While dynamics of the bonding front has been analytically studied and modelled [1-4], the literature gives not much information about its characterization. This study is then focused on adhesion energy (Ea) and bonding wave velocity (Vo) measurement. After considerations about immediate and stabilized adhesion energy, we will show the dependence between Ea and Vo and we will confirm Rieutord’s model [1] for hydrophilic direct bonding. Roughness dependence, plasma pre-treatment, hydrophobic direct bonding and re-bonding will also be discussed.