Christophe Morales

Hydrophilic low-temperature direct wafer bonding

Caroline Ventosa, F. Rieutord, L. Libralesso et al. · Journal of Applied Physics · 2008 · 103 citations

Materials Engineering, Materials Science, Wafer Scale Processing +12

Overview of recent direct wafer bonding advances and applications

H. Moriceau, F. Rieutord, Frank Fournel et al. · Advances in Natural Sciences Nanoscience and Nanotechnology · 2011 · 82 citations · Full text

Materials Science, Materials Engineering, Electrical Engineering +15

Water Stress Corrosion in Bonded Structures

Frank Fournel, Chloé Martin-Cocher, Damien Radisson et al. · ECS Journal of Solid State Science and Technology · 2015 · 82 citations · Full text

Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology

Frank Fournel, Léonardo Continni, Christophe Morales et al. · Journal of Applied Physics · 2012 · 74 citations · Full text

Engineering, Chemistry, Silicon On Insulator +17

First demonstration of a CMOS over CMOS 3D VLSI CoolCube™ integration on 300mm wafers

Laurent Brunet, P. Batude, C. Fenouillet-Béranger et al. · 2016 · 74 citations

Engineering, Vlsi Design, Integrated Circuits +18