Frank Fournel

Hybrid superconductor–semiconductor devices made from self-assembled SiGe nanocrystals on silicon

Georgios Katsaros, Panayotis Spathis, M. Stoffel et al. · Nature Nanotechnology · 2010 · 155 citations · Full text

Semiconductors, Materials Science, Hybrid Superconductor–semiconductor Devices +6

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 114 citations

Insulator Wafers, Semiconductor Technology, Electrical Engineering +8

Hydrophilic low-temperature direct wafer bonding

Caroline Ventosa, F. Rieutord, L. Libralesso et al. · Journal of Applied Physics · 2008 · 103 citations

Materials Engineering, Materials Science, Wafer Scale Processing +12

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16