C. Mazuré

FeRAM technology for high density applications

Thomas Mikolajick, C. Dehm, Walter Hartner et al. · Microelectronics Reliability · 2001 · 171 citations

Engineering, Materials Engineering, Petroleum Engineering +4

Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices

T. Akatsu, C. Deguet, Loïc Sanchez et al. · Materials Science in Semiconductor Processing · 2006 · 130 citations

Engineering, Materials Engineering, Materials Science +11

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 117 citations

Engineering, Materials Engineering, Materials Science +14

A model for phosphorus segregation at the silicon-silicon dioxide interface

F. Lau, Leonhard Mader, C. Mazuré et al. · Applied Physics A · 1989 · 95 citations

Engineering, Materials Engineering, Materials Science +11

Smart-Cut® technology: from 300 mm ultrathin SOI production to advanced engineered substrates

Christophe Maleville, C. Mazuré · Solid-State Electronics · 2004 · 73 citations

Engineering, Materials Engineering, Materials Science +13