C. Mazuré

FeRAM technology for high density applications

Thomas Mikolajick, C. Dehm, Walter Hartner et al. · Microelectronics Reliability · 2001 · 165 citations

Materials Science, Engineering, Applied Physics +3

Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices

T. Akatsu, C. Deguet, Loïc Sanchez et al. · Materials Science in Semiconductor Processing · 2006 · 128 citations

Electronic Devices, Engineering, Electronic Engineering +5

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 114 citations

Insulator Wafers, Semiconductor Technology, Electrical Engineering +8

A model for phosphorus segregation at the silicon-silicon dioxide interface

F. Lau, Leonhard Mader, C. Mazuré et al. · Applied Physics A · 1989 · 95 citations

Engineering, Physics, Phosphorus Segregation +9

Smart-Cut® technology: from 300 mm ultrathin SOI production to advanced engineered substrates

Christophe Maleville, C. Mazuré · Solid-State Electronics · 2004 · 72 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +8