Loïc Sanchez

Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices

T. Akatsu, C. Deguet, Loïc Sanchez et al. · Materials Science in Semiconductor Processing · 2006 · 130 citations

Engineering, Materials Engineering, Materials Science +11

Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force

Jean Berthier, Sébastien Mermoz, Kenneth A. Brakke et al. · Microfluidics and Nanofluidics · 2012 · 28 citations

Engineering, Bioengineering, Materials Science +13

Enabling 3D Monolithic Integration

P. Batude, M. Vinet, A. Pouydebasque et al. · ECS Transactions · 2008 · 23 citations

Engineering, Electrical Engineering, Materials Engineering +17

Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding

Emilie Bourjot, C. Castan, Noura Nadi et al. · 2021 · 19 citations

Engineering, Manufacturing Engineering, Interconnection Networks +13

Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration

Alice Bond, Emilie Bourjot, S. Borel et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 19 citations

Engineering, Manufacturing Engineering, Materials Science +14