Sébastien Mermoz

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Engineering, Materials Science, Electronic Materials +13

Chip to wafer direct bonding technologies for high density 3D integration

L. Sanchez, Laurent Bally, Brigitte Montmayeul et al. · 2012 · 29 citations

Engineering, Materials Engineering, Materials Science +17

Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force

Jean Berthier, Sébastien Mermoz, Kenneth A. Brakke et al. · Microfluidics and Nanofluidics · 2012 · 28 citations

Engineering, Bioengineering, Materials Science +13