L. Sanchez

Advances, challenges and opportunities in 3D CMOS sequential integration

P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text

Materials Science, 3D Ic Architecture, Wafer Scale Processing +15

Advances in 3D CMOS sequential integration

P. Batude, M. Vinet, A. Pouydebasque et al. · 2009 · 114 citations

Engineering, Vlsi Design, Sequential Cmos Integration +17

Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium

C. Deguet, L. Sanchez, T. Akatsu et al. · Electronics Letters · 2006 · 65 citations

Engineering, Silicon On Insulator, Rf Semiconductor +16

3D monolithic integration: Technological challenges and electrical results

M. Vinet, P. Batude, C. Tabone et al. · Microelectronic Engineering · 2010 · 65 citations

3D Ic Architecture, Engineering, Advanced Packaging (Semiconductors) +5

Self-alignment of silicon chips on wafers: A capillary approach

Jean Berthier, Kenneth A. Brakke, François Grossi et al. · Journal of Applied Physics · 2010 · 54 citations

Engineering, Integrated Circuits, Silicon On Insulator +21