L. Sanchez

Advances, challenges and opportunities in 3D CMOS sequential integration

P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Advances in 3D CMOS sequential integration

P. Batude, M. Vinet, A. Pouydebasque et al. · 2009 · 115 citations

Engineering, Computer Engineering, Electrical Engineering +15

3D monolithic integration: Technological challenges and electrical results

M. Vinet, P. Batude, C. Tabone et al. · Microelectronic Engineering · 2010 · 69 citations

Engineering, Electrical Engineering, Microelectronics +13

Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium

C. Deguet, L. Sanchez, T. Akatsu et al. · Electronics Letters · 2006 · 66 citations

Engineering, Materials Engineering, Materials Science +13

Self-alignment of silicon chips on wafers: A capillary approach

Jean Berthier, Kenneth A. Brakke, François Grossi et al. · Journal of Applied Physics · 2010 · 54 citations

Engineering, Manufacturing Engineering, Microelectromechanical Systems +16