C. Deguet

Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices

T. Akatsu, C. Deguet, Loïc Sanchez et al. · Materials Science in Semiconductor Processing · 2006 · 130 citations

Engineering, Materials Engineering, Materials Science +11

Overview of recent direct wafer bonding advances and applications

H. Moriceau, F. Rieutord, Frank Fournel et al. · Advances in Natural Sciences Nanoscience and Nanotechnology · 2011 · 84 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium

C. Deguet, L. Sanchez, T. Akatsu et al. · Electronics Letters · 2006 · 66 citations

Engineering, Materials Engineering, Materials Science +13

Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy

M. Legros, Thomas Signamarcheix, Laurent Bally et al. · Thin Solid Films · 2012 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +13

Low temperature direct bonding: An attractive technique for heterostructures build-up

H. Moriceau, F. Rieutord, Frank Fournel et al. · Microelectronics Reliability · 2011 · 44 citations

Engineering, Materials Engineering, Materials Science +11