Christophe Maleville

Basic mechanisms involved in the Smart-Cut® process

B. Aspar, M. Bruel, H. Moriceau et al. · Microelectronic Engineering · 1997 · 138 citations

Industrial Design, Engineering, Digital Manufacturing +3

The generic nature of the Smart-Cut® process for thin film transfer

B. Aspar, H. Moriceau, E. Jalaguier et al. · Journal of Electronic Materials · 2001 · 108 citations

Materials Science, Engineering, Smart-cut® Process +8

Smart-Cut® technology: from 300 mm ultrathin SOI production to advanced engineered substrates

Christophe Maleville, C. Mazuré · Solid-State Electronics · 2004 · 72 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +8

"Smart cut": a promising new SOI material technology

M. Bruel, B. Aspar, Barbara Charlet et al. · 2002 · 56 citations

Engineering, Material Innovation, Vacuum Device +18

Wafer bonding and H-implantation mechanisms involved in the Smart-cut® technology

Christophe Maleville, B. Aspar, T. Poumeyrol et al. · Materials Science and Engineering B · 1997 · 38 citations

Materials Engineering, Materials Science, Wafer Scale Processing +9