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A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
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2013
Year
Unknown Venue
PhotonicsSoi WafersOptical InterconnectsEngineeringIntegrated PhotonicsDevice IntegrationApplied PhysicsNanophotonicsComputer EngineeringIntegrated Optical CommunicationsIntegrated CircuitsPhotonic Integrated CircuitProgrammable PhotonicsSilicon On InsulatorSilicon Photonics PlatformPhotonic DeviceOptoelectronicsSilicon Photonics
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.