A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

S. Crémer, Nathalie Vulliet, Thierry Pinguet, Attila Mekis, G. Masini, Lieven Verslegers, Peng Sun, Ali Ayazi, N.-K. Hon, Subal Sahni,

2013 · 95 citations · 0 references

Concepts

Abstract

Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.