Lieve Bogaerts

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 191 citations

Engineering, Materials Engineering, Materials Science +17

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn et al. · 2018 · 46 citations

Engineering, Electrical Engineering, Microelectronics +16

Small Pitch, High Aspect Ratio Via-Last TSV Module

Stefaan Van Huylenbroeck, Michele Stucchi, Yunlong Li et al. · 2016 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing

Joan Juvert, Tommaso Cassese, Sarah Uvin et al. · Optics Express · 2018 · 30 citations · Full text

Engineering, Electrical Engineering, Optoelectronics +16

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers

Bradley Snyder, Nivesh Mangal, Guy Lepage et al. · Optical Fiber Communication Conference · 2018 · 27 citations

Engineering, Electrical Engineering, Materials Science +17