Kenneth June Rebibis

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +13

Hybrid 14nm FinFET - Silicon Photonics Technology for Low-Power Tb/s/mm ² Optical I/O

Michał Rakowski, Yuseok Ban, Peter De Heyn et al. · 2018 · 46 citations

Engineering, Electrical Engineering, Microelectronics +16

Influence of Si wafer thinning processes on (sub)surface defects

Fumihiro Inoue, Anne Jourdain, Lan Peng et al. · Applied Surface Science · 2017 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +12

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Arnita Podpod, John Slabbekoorn, Alain Phommahaxay et al. · 2018 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations

Engineering, Electrical Engineering, Materials Science +15