Biljana Dimčić

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Rahul Agarwal, Wenqi Zhang, Paresh Limaye et al. · 2010 · 96 citations

Engineering, Mechanical Engineering, Computer Architecture +17

Microstructure and mechanical properties of precision cast TiAl turbocharger wheel

M. Jovanović, Biljana Dimčić, Ilija Bobić et al. · Journal of Materials Processing Technology · 2005 · 58 citations

Materials Science, Engineering, Mechanical Properties +5

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

Materials Engineering, Inorganic Chemistry, Materials Science +8

Influence of SiC particles distribution on mechanical properties and fracture of DRA alloys

D. Božić, Biljana Dimčić, O. Dimčić et al. · Materials & Design (1980-2015) · 2009 · 45 citations

Materials Science, Engineering, Mechanical Properties +9

Application of ANOVA method to precipitation behaviour studies

Z. Cvijović, Goran Radenković, Vesna Maksimović et al. · Materials Science and Engineering A · 2005 · 41 citations

Meteorology, Surface Runoff, Engineering +6