Biljana Dimčić

Cu/Sn microbumps interconnect for 3D TSV chip stacking

Rahul Agarwal, Wenqi Zhang, Paresh Limaye et al. · 2010 · 96 citations

Engineering, Materials Engineering, Materials Science +15

Microstructure and mechanical properties of precision cast TiAl turbocharger wheel

M. Jovanović, Biljana Dimčić, Ilija Bobić et al. · Journal of Materials Processing Technology · 2005 · 59 citations

Engineering, Materials Engineering, Materials Science +12

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +13

Influence of SiC particles distribution on mechanical properties and fracture of DRA alloys

D. Božić, Biljana Dimčić, O. Dimčić et al. · Materials & Design (1980-2015) · 2009 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +12

Application of ANOVA method to precipitation behaviour studies

Z. Cvijović, Goran Radenković, Vesna Maksimović et al. · Materials Science and Engineering A · 2005 · 42 citations

Natural Sciences, Hydrology, Meteorology +10