George Vakanas

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

Materials Engineering, Inorganic Chemistry, Materials Science +8

Formation of compounds and Kirkendall vacancy in the Cu–Sn system

O Minho, George Vakanas, Nele Moelans et al. · Microelectronic Engineering · 2013 · 45 citations · Full text

Materials Science, Materials Engineering, Transition Metal Chalcogenides +9

Milling of submicron channels on gold layer using double charged arsenic ion beam

Ampere A. Tseng, Ivan A. Insua, Jong S. Park et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2004 · 24 citations

Afm Measurements, Engineering, Microscopy +17

Reflow process optimization for micro-bumps applications in 3D technology

Jaber Derakhshandeh, Inge De Preter, Luke England et al. · 2014 · 15 citations

Commercial Reflow Ovens, Engineering, Reflow Process +12

Cobalt UBM for fine pitch microbump applications in 3DIC

Jaber Derakhshandeh, Inge De Preter, K. Vandersmissen et al. · 2015 · 10 citations

Engineering, Cobalt Ubm, Mechanical Engineering +18