Luke England

Advanced packaging saves the day! — How TSV technology will enable continued scaling

Luke England, Igor Arsovski · 2017 · 25 citations

AN ELECTRON-MIRROR INFRARED IMAGE CONVERTER USING VITREOUS SELENIUM-BISMUTH PHOTOCONDUCTING LAYERS

Clayton W. Bates, Luke England · Applied Physics Letters · 1969 · 24 citations

Photonics, Electrical Engineering, Optical Materials +13

Process Development and Optimization for 3 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

Dingyou Zhang, Daniel M. Smith, Gopal Kumarapuram et al. · IEEE Transactions on Semiconductor Manufacturing · 2015 · 21 citations

Engineering, Process Development, Dielectric Liner Coverage +16

TSV residual Cu step height analysis by white light interferometry for 3D integration

Daniel M. Smith, Sanjeev Singh, Yudesh Ramnath et al. · 2015 · 20 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +11

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Tiwei Wei, Herman Oprins, Vladimir Cherman et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 20 citations

Advanced Packaging, Numerical Study, Nozzle Pitch +13