Concepedia

Dingyou Zhang

DZ

3

Publications

53

Citations

3

H-Index

2011

Active since

Affiliations

GlobalFoundries (United States)(Current)

Dingyou Zhang is an author at GlobalFoundries (United States) specializing in engineering, applied physics, and electronic packaging.

Top concepts

EngineeringApplied PhysicsElectronic PackagingElectrical EngineeringPhysicsChemistry3D PrintingCalibrationInterferometryInstrumentation

Publications per year

2011–2015

3

Publications

3

Process Development and Optimization for 3 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

Dingyou Zhang, Daniel M. Smith, Gopal Kumarapuram et al. · IEEE Transactions on Semiconductor Manufacturing · 2015 · 21 citations

Engineering, Process Development, Dielectric Liner Coverage +16

TSV residual Cu step height analysis by white light interferometry for 3D integration

Daniel M. Smith, Sanjeev Singh, Yudesh Ramnath et al. · 2015 · 20 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +11

Thick benzocyclobutene etching using high density SF6/O2 plasmas

Qianwen Chen, Dingyou Zhang, Zhimin Tan et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2011 · 12 citations

Materials Science, Thick Benzocyclobutene, Material Analysis +14

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