Zhimin Tan

Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation

Jing Chen, Litian Liu, Zhijian Li et al. · Sensors and Actuators A Physical · 2002 · 59 citations

Materials Science, Materials Engineering, Engineering +11

Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers

Qianwen Chen, Cui Huang, Zhimin Tan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 58 citations

Engineering, Silicon On Insulator, Low Capacitance Through-silicon-vias +16

On the single-chip condenser miniature microphone using DRIE and backside etching techniques

Jing Chen, Litian Liu, Zhijian Li et al. · Sensors and Actuators A Physical · 2002 · 42 citations

Acoustic Camera, Engineering, Microfabrication +3

Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers

Qianwen Chen, Cui Huang, Dong Wu et al. · IEEE Transactions on Electron Devices · 2013 · 40 citations

Materials Science, Electrical Engineering, Engineering +15

Time Domain Simulation of the 3D Bending Hysteresis Behavior of an Unbonded Flexible Riser

Zhimin Tan, Peter Quiggin, Terry Sheldrake · Journal of Offshore Mechanics and Arctic Engineering · 2009 · 38 citations

Engineering, Structural Dynamics, Mechanical Engineering +21