Recovery of rare earths from industrial wastewater using extraction-precipitation strategy for resource and environmental concerns

Shuainan Ni, Qianwen Chen, Yun Gao, +2

Minerals Engineering

EngineeringEnvironmental EngineeringEnvironmental ConcernsExtraction-precipitation StrategyRecycling +8

Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers

Qianwen Chen, Cui Huang, Dong Wu, +2

IEEE Transactions on Electron Devices

Materials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Flexible Electronics +13

Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network

Zheng Xu, Adam Beece, Dingyou Zhang, +4

Crosstalk MatricesElectrical EngineeringTsv Crosstalk PerformanceEngineeringAdvanced Packaging (Semiconductors) +13

A recovery strategy of Sm, Co for waste SmCo magnets by fatty acid based ionic liquids

Qianwen Chen, Shuainan Ni, Guanghua Ai, +2

Minerals Engineering

Materials ScienceMagnetismChemical EngineeringMagnetic PropertiesEngineering +9

Air-Gap Through-Silicon Vias

Cui Huang, Qianwen Chen, Zheyao Wang

IEEE Electron Device Letters

Materials Science3D Ic ArchitectureElectrical EngineeringEngineeringElectronic Materials +13

Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling

Bing Dang, E. G. Colgan, Fanghao Yang, +11

EngineeringLiquid Metal CoolingRefrigerationAdvanced Packaging (Semiconductors)Chip Cooling +15

Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture

Zheng Xu, Adam Beece, Dingyou Zhang, +3

EngineeringComputer-aided DesignIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility +21

Short- and medium-chain chlorinated paraffins in soil from an urban area of northern China: Levels, distribution, and homolog patterns

Kunran Wang, Lirong Gao, Shuai Zhu, +8

The Science of The Total Environment

Environmental ChemistryMedium-chain Chlorinated ParaffinsEngineeringEnvironmental EngineeringSoil Science +5

A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment

Qianwen Chen, Dingyou Zhang, Zheng Xu, +6

Microelectronic Engineering

3D Ic ArchitectureElectrical EngineeringPrecise AlignmentEngineeringIntegration Approach +12

Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

Qianwen Chen, Wuyang Yu, Cui Huang, +2

Microelectronics Reliability

Materials EngineeringEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsBenzocyclobutene Liners +3