Concepedia
Statistics
Publications
17
Citations
539
H-Index
16
Active since
2012
Affiliations
Tsinghua University(Current)
Institute of Microelectronics
State Key Laboratory of Chemical Engineering
Tianjin University
Collaborative Innovation Center of Chemical Science and Engineering Tianjin
Cui Huang is an author at Tsinghua University specializing in engineering, microelectronics, and electronic packaging.
Top concepts
EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceElectrical EngineeringMicrofabricationElectrical InsulationChemistryFlexible Electronics
Publications per year
2012–2017
Thermodynamic equilibrium of 4-hydroxy-2,5-dimethyl-3(2H)-furanone in different solvent systems
Jinchao Xu, Yongli Wang, Guan Wang et al. · The Journal of Chemical Thermodynamics · 2015 · 73 citations
Chemical Engineering, Chemical Thermodynamics, Engineering +7
Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers
Qianwen Chen, Cui Huang, Zhimin Tan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 58 citations
Engineering, Silicon On Insulator, Low Capacitance Through-silicon-vias +16
The liquid–liquid phase separation and crystallization of vanillin in 1-propanol/water solution
Yanni Du, Haiyang Wang, Shichao Du et al. · Fluid Phase Equilibria · 2015 · 44 citations
Chemical Engineering, Engineering, 1-Propanol/water Solution +7
High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layers
Cui Huang, Qianwen Chen, Dong Wu et al. · Microelectronic Engineering · 2012 · 41 citations
Materials Science, 3D Ic Architecture, Electrical Engineering +13
Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers
Qianwen Chen, Cui Huang, Dong Wu et al. · IEEE Transactions on Electron Devices · 2013 · 40 citations
Materials Science, Electrical Engineering, Engineering +15
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