Dingyou Zhang

Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network

Zheng Xu, Adam Beece, Dingyou Zhang et al. · 2010 · 40 citations

Engineering, Computer Engineering, Electrical Engineering +17

Backside TSV protrusion induced by thermal shock and thermal cycling

Dingyou Zhang, Klaus Hummler, Larry Smith et al. · 2013 · 30 citations

Engineering, Materials Engineering, Materials Science +17

Chip-to-wafer (C2W) 3D integration with well-controlled template alignment and wafer-level bonding

Qianwen Chen, Dingyou Zhang, Zheyao Wang et al. · 2011 · 23 citations

Engineering, Materials Engineering, Materials Science +16

Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture

Zheng Xu, Adam Beece, Dingyou Zhang et al. · 2010 · 20 citations

Engineering, Electrical Engineering, Materials Science +17

A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment

Qianwen Chen, Dingyou Zhang, Zheng Xu et al. · Microelectronic Engineering · 2011 · 18 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16