16
Publications
373
Citations
11
H-Index
1969
Active since
Larry Smith is an author at University at Albany, State University of New York specializing in engineering, microelectronics, and electronic packaging.
Top concepts
EngineeringMicroelectronicsApplied PhysicsElectronic PackagingElectrical EngineeringMaterial ScienceMedicineNatural SciencesElectrical Insulation3D Printing
Publications per year
1969–2018
16
16
Yield considerations in the choice of 3D technology
Greg Smith, Larry Smith, Sharath Hosali et al. · 2007 · 45 citations
Backside TSV protrusion induced by thermal shock and thermal cycling
Dingyou Zhang, Klaus Hummler, Larry Smith et al. · 2013 · 30 citations
Engineering, Mechanical Engineering, Thermal Conductivity +16
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1–5 of 16