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A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment

3D Ic ArchitectureElectrical EngineeringPrecise AlignmentEngineeringIntegration ApproachAdvanced Packaging (Semiconductors)MicrofabricationWafer Scale ProcessingChip AttachmentComputer-aided Design3D PrintingElectronic PackagingThree-dimensional Integrated CircuitsNovel Chip-to-wafer3D IntegrationInterconnect (Integrated Circuits)Microelectronics