Robert Patti

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 589 citations

Engineering, Computer Architecture, Integrated Circuits +19

Exploring DRAM organizations for energy-efficient and resilient exascale memories

Bharan Giridhar, Michael Cieslak, Deepankar Duggal et al. · 2013 · 59 citations

Hardware Security, Dram Organizations, Error Correction Cost +10

Fully 3-D Integrated Pixel Detectors for X-Rays

G. Deptuch, G. Carini, P.M. Enquist et al. · IEEE Transactions on Electron Devices · 2015 · 33 citations · Full text

Photonic Sensor, Engineering, Device Integration +26

A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits

Po-Hsuan Chang, Anirban Samanta, Peng Yan et al. · Journal of Lightwave Technology · 2023 · 29 citations · Full text

Optical Materials, Engineering, Device Integration +26

Interconnect design and analysis for Through Silicon Interposers (TSIs)

Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo et al. · 2012 · 28 citations

Engineering, Vlsi Design, Computer Architecture +16