Klaus Hummler - Concepedia

Author

Klaus Hummler

National Institute of Standards and Technology

Also Known As

K. Hummler, Klaus Hummler, Klaus M. Hummler

Publications

396

Citations

H-Index

Concepts

All Affiliations

National Institute of Standards and Technology University at Albany, State University of New York Physical Measurement Laboratory Albany State University Argonne National Laboratory

About

Klaus Hummler is an author at National Institute of Standards and Technology specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	301
2	Applied Physics	7	7	185
3	Electrical Engineering	2	2	120
4	Natural Sciences	1	1	31
5	Materials Engineering	1	1	101

Klaus Hummler

Publications

325

Citations

H-Index

Page 1

	Year	Citations
A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability Chukwudi Okoro, June W. Lau, Fardad Golshany, IEEE Transactions on Electron Devices Electrical ResistanceEngineeringCu Tsv ReliabilityMechanical EngineeringDaisy Chains	2014	101
Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction Chukwudi Okoro, Lyle E. Levine, Ruqing Xu, IEEE Transactions on Electron Devices Finfet KozEngineeringSevere Plastic DeformationCu TsvsResidual Stress	2014	36
TSV reveal etch for 3D integration Stephen Olson, Klaus Hummler EngineeringMechanical Engineering3D ModelingMechanical GrindComputer-aided Design	2012	31
Backside TSV protrusion induced by thermal shock and thermal cycling Dingyou Zhang, Klaus Hummler, Larry Smith, EngineeringMechanical EngineeringThermal ConductivityAdvanced Packaging (Semiconductors)Backside Tsv Protrusion	2013	30
Metrology needs for through-silicon via fabrication Victor Vartanian, Richard A. Allen, Larry Smith, Journal of Micro/Nanolithography MEMS and MOEMS Materials ScienceMetrology ChallengesWafer Scale ProcessingEngineeringFill Step	2014	30
Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias Chukwudi Okoro, Lyle E. Levine, Ruqing Xu, Journal of Applied Physics EngineeringSevere Plastic DeformationStacked DiesInterconnect (Integrated Circuits)Structural Materials	2014	25
Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals Chukwudi Okoro, Pavel Kaboš, Jan Obrzut, IEEE Transactions on Electron Devices EngineeringElectromagnetic CompatibilityReliability EngineeringAdvanced Packaging (Semiconductors)Electronic Packaging	2013	19
Challenges in thin wafer handling and processing Stephen Olson, Klaus Hummler, Brian Sapp Advanced Packaging3D Ic ArchitectureChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	2013	15
Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis Kuan Lu, Suk-Kyu Ryu, Qiu Zhao, EngineeringBending Beam ExperimentMechanical EngineeringCu TsvsResidual Stress	2011	14
TSV and Cu-Cu direct bond wafer and package-level reliability Klaus Hummler, Brian Sapp, J. R. Lloyd,	2013	12

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