Concepedia

Klaus Hummler

KH

11

Publications

325

Citations

11

H-Index

2011

Active since

Affiliations

National Institute of Standards and Technology(Current)

University at Albany, State University of New York

Physical Measurement Laboratory

Albany State University

Argonne National Laboratory

Klaus Hummler is an author at National Institute of Standards and Technology specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceMechanical EngineeringMechanics Of MaterialsHeat TransferMicrostructureSolid Mechanics

Publications per year

2011–2014

11

Publications

11

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

Chukwudi Okoro, June W. Lau, Fardad Golshany et al. · IEEE Transactions on Electron Devices · 2014 · 101 citations

Electrical Resistance, Engineering, Cu Tsv Reliability +20

Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction

Chukwudi Okoro, Lyle E. Levine, Ruqing Xu et al. · IEEE Transactions on Electron Devices · 2014 · 36 citations

Finfet Koz, Engineering, Severe Plastic Deformation +19

TSV reveal etch for 3D integration

Stephen Olson, Klaus Hummler · 2012 · 31 citations

Engineering, Mechanical Engineering, 3D Modeling +21

Backside TSV protrusion induced by thermal shock and thermal cycling

Dingyou Zhang, Klaus Hummler, Larry Smith et al. · 2013 · 30 citations

Engineering, Mechanical Engineering, Thermal Conductivity +16

Metrology needs for through-silicon via fabrication

Victor Vartanian, Richard A. Allen, Larry Smith et al. · Journal of Micro/Nanolithography MEMS and MOEMS · 2014 · 30 citations

Materials Science, Metrology Challenges, Wafer Scale Processing +14

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