Concepedia

Gopal Kumarapuram

GK

2

Publications

33

Citations

2

H-Index

2014

Active since

Affiliations

GlobalFoundries (United States)(Current)

Gopal Kumarapuram is an author at GlobalFoundries (United States) specializing in electronic packaging, applied physics, and microfabrication.

Top concepts

EngineeringApplied PhysicsMicroelectronicsMicrofabricationElectronic PackagingElectrical Engineering3D PrintingAdvanced PackagingIntegrated Circuits

Publications per year

2014–2015

2

Publications

2

Process Development and Optimization for 3 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

Dingyou Zhang, Daniel M. Smith, Gopal Kumarapuram et al. · IEEE Transactions on Semiconductor Manufacturing · 2015 · 21 citations

Engineering, Process Development, Dielectric Liner Coverage +16

Successful void free gap fill of 3&#x00B5;m, high AR via middle, Through Silicon Vias at wafer level

Sarasvathi Thangaraju, Luke England, Mohamed A. Rabie et al. · 2014 · 12 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

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