Concepedia

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić, Kris Vanstreels, Björn Vandecasteele, Inge De Preter, Jaber Derakhshandeh, Kenneth June Rebibis, Masanori Kajihara, Ingrid De Wolf,

Microelectronic Engineering · 2015 · 51 citations · 10 references

DOI

Concepts

References

10

Intrinsic and Interdiffusion in Cu-Sn System

Santosh Kumar, Carol A. Handwerker, M. A. Dayananda · Journal of Phase Equilibria and Diffusion · 2011 · 101 citations

, , +10

Sn/Co solid/solid interfacial reactions

Chao-hong Wang, Sinn-wen Chen · Intermetallics · 2008 · 78 citations

, , +12

Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co

Fangjie Cheng, Hiroshi Nishikawa, Tadashi Takemoto · Journal of Materials Science · 2008 · 73 citations

, , +13

Temperature effects on liquid-state Sn/Co interfacial reactions

Chao-hong Wang, Chun-yi Kuo, Sheng-en Huang et al. · Intermetallics · 2012 · 55 citations

, , +14

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George Vakanas, O Minho, Biljana Dimčić et al. · Microelectronic Engineering · 2015 · 51 citations

, , +13