Interconnect Characterization
Interconnect Characterization is a systematic method within interconnect technology that identifies, quantifies, and models the electrical, physical, and performance attributes of interconnect structures to evaluate their behavior and reliability under operational conditions.
704
Publications
26.8K
Citations
2.5K
Authors
495
Institutions
Publications per year
2017–2026
86
Parents
704
Sheng Li, Jung Ho Ahn, Richard Strong et al. · 2009 · 2.4K citations
Carbon nanotubes in interconnect applications
Franz Kreupl, Anthony Graham, Georg S. Duesberg et al. · Microelectronic Engineering · 2002 · 630 citations
Luca Daniel, O.C. Siong, L.S. Chay et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2004 · 342 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +17
1–5 of 704
2.5K
10
h-index
10
h-index
10
h-index
9
h-index
IBM Research - Thomas J. Watson Research Center, United States
9 publications · 395 citations
9
h-index
1–5 of 2.5K
495
IBM (United States)
Armonk, United States
23 h-index
180 publications
5.8K citations
IBM Research - Thomas J. Watson Research Center
Yorktown Heights, United States
22 h-index
112 publications
5.2K citations
IMEC
Leuven, Belgium
16 h-index
176 publications
6.1K citations
Nanyang Technological University
Singapore, Singapore
16 h-index
44 publications
1.2K citations
Intel (United States)
Santa Clara, United States
15 h-index
60 publications
1.6K citations
Motorola (United States)
Schaumburg, United States
15 h-index
57 publications
2.4K citations
Massachusetts Institute of Technology
Cambridge, United States
14 h-index
49 publications
2.6K citations
Georgia Institute of Technology
Atlanta, United States
13 h-index
42 publications
1.9K citations
1–8 of 495
36 publications · 922 citations
20
h-index
22 publications · 1.3K citations
16
h-index
19 publications · 992 citations
16
h-index
16 publications · 994 citations
14
h-index
14 publications · 823 citations
13
h-index
1–5