Masanori Kajihara

Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433–473K

Takeshi Takenaka, Satoru S. Kano, Masanori Kajihara et al. · Materials Science and Engineering A · 2005 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +14

Growth behavior of Ni3Sn4 layer during reactive diffusion between Ni and Sn at solid-state temperatures

Mai Mita, Masanori Kajihara, N. Kurokawa et al. · Materials Science and Engineering A · 2005 · 108 citations

Natural Sciences, Materials Engineering, Materials Science +11

Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures

Tomoaki Yamada, Kouji Miura, Masanori Kajihara et al. · Materials Science and Engineering A · 2004 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +14

Relationship between temperature dependence of interdiffusion and kinetics of reactive diffusion in a hypothetical binary system

Masanori Kajihara · Materials Science and Engineering A · 2005 · 55 citations

Natural Sciences, Physics, Physical Chemistry +13

Growth behavior of Nb3Sn layer during reactive diffusion between Cu–8.3Sn alloy and Nb

Y. Muranishi, Masanori Kajihara · Materials Science and Engineering A · 2005 · 55 citations

Natural Sciences, Materials Engineering, Materials Science +9